UT8R2M39-22XFC
2M X 39 MULTI DEVICE SRAM MODULE, 22 ns, CQFP132

From Aeroflex / Colorado Springs

StatusACTIVE
Access Time-Max (tACC)22 ns
Memory Density8.18E7 deg
Memory IC TypeMULTI DEVICE SRAM MODULE
Memory Width39
Mfr Package Description0.900 INCH, CERAMIC, SIDE BRAZED, QFP-132
Number of Functions1
Number of Terminals132
Number of Words2.10E6 words
Number of Words Code2M
Operating ModeASYNCHRONOUS
Operating Temperature-Max105 Cel
Operating Temperature-Min-55 Cel
Organization2M X 39
Package Body MaterialCERAMIC, METAL-SEALED COFIRED
Package ShapeSQUARE
Package StyleFLATPACK, GUARD RING
Parallel/SerialPARALLEL
Supply Voltage-Max (Vsup)2 V
Supply Voltage-Min (Vsup)1.7 V
Supply Voltage-Nom (Vsup)1.9 V
Surface MountYes
TechnologyCMOS
Temperature GradeOTHER
Terminal FinishGOLD
Terminal FormGULL WING
Terminal Pitch0.6350 mm
Terminal PositionQUAD

External links