CL03A474KQ3NNNH Cap Ceramic 0.47uF 6.3V X5R 10% SMD 0201 85C Cardboard T/R
From SAMSUNG
| Capacitance | 470000 pF |
| Case Style | Ceramic Chip |
| Construction | SMT Chip |
| Failure Rate | Not Required |
| Mounting Style | Surface Mount |
| Operating Temp Range | -55C to 85C |
| Package / Case | 0201 |
| Packaging | Tape and Reel |
| Product Depth (mm) | 0.3 mm |
| Product Diameter (mm) | Not Required mm |
| Product Height (mm) | 0.3 mm |
| Product Length (mm) | 0.6 mm |
| Rad Hardened | No |
| Temp Coeff (Dielectric) | X5R |
| Tolerance (+ or -) | 10% |
| Voltage | 6.3VDC |
| Wire Form | Not Required |
