9BF116NPF MB9BF112NPMC MB9BF114NPMC MB9BF115NPMC Plastic x LQFP 100-pin (0.5mm pitch), (FPT-100P-M20*/M23) MB9BF116NPMC MB9BF112RPMC MB9BF114RPMC MB9BF115RPMC Plastic x LQFP 120-pin (0.5mm pitch), (FPT-120P-M21*/M37) MB9BF116RPMC MB9BF112NBGL MB9BF114NBGL MB9BF115NBGL Plastic x PFBGA 112-pin (0.8mm pitch), (BGA-112P-M04) MB9BF116NBGL * : ES product only 106 FUJITSU SEMICONDUCTOR CONFIDENTIAL DS706-00028-1v0-E r1.0 MB9B110R Series PACKAGE DIMENSIONS 100-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 14.0 mm x 14.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm Max Weight 0.65 g Code (Reference) P-LFQFP100-14x14-0.50 (FPT-100P-M20) 100-pin plastic LQFP (FPT-100P-M20) Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 16.000.20(.630.008)SQ *14.000.10(.551.004)SQ 51 75 76 50 0.08(.003) Details of "A" part +0.20 26 100
9BF116NPF MB9BF112NPMC MB9BF114NPMC MB9BF115NPMC Plastic x LQFP 100-pin (0.5mm pitch), (FPT-100P-M20*/M23) MB9BF116NPMC MB9BF112RPMC MB9BF114RPMC MB9BF115RPMC Plastic x LQFP 120-pin (0.5mm pitch), (FPT-120P-M21*/M37) MB9BF116RPMC MB9BF112NBGL MB9BF114NBGL MB9BF115NBGL Plastic x PFBGA 112-pin (0.8mm pitch), (BGA-112P-M04) MB9BF116NBGL * : ES product only 106 FUJITSU SEMICONDUCTOR CONFIDENTIAL DS706-00028-0v01-E r1.0 MB9B110R Series PACKAGE DIMENSIONS 100-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 14.0 mm x 14.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm Max Weight 0.65 g Code (Reference) P-LFQFP100-14x14-0.50 (FPT-100P-M20) 100-pin plastic LQFP (FPT-100P-M20) Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 16.000.20(.630.008)SQ *14.000.10(.551.004)SQ 51 75 76 50 0.08(.003) Details of "A" part +0.20 26 100
te Work: 32 Kbyte 16 Kbyte MB9BF115RPMC-JNE2 Main: 384 Kbyte Work: 32 Kbyte 24 Kbyte MB9BF116RPMC-JNE2 Main: 512 Kbyte Work: 32 Kbyte 32 Kbyte MB9BF112NBGL-GE1 Main: 128 Kbyte Work: 32 Kbyte 8 Kbyte MB9BF114NBGL-GE1 Main: 256 Kbyte Work: 32 Kbyte 16 Kbyte MB9BF115NBGL-GE1 Main: 384 Kbyte Work: 32 Kbyte 24 Kbyte MB9BF116NBGL-GE1 Main: 512 Kbyte Work: 32 Kbyte 32 Kbyte Part number March 11, 2015, MB9B110R-DS706-00028-3v0-E CONFIDENTIAL Package Packing Plastic QFP 100-pin (0.65 mm pitch), (FPT-100P-M03) Plastic LQFP 100-pin (0.5 mm pitch), (FPT-100P-M23) Tray Plastic LQFP 120-pin (0.5 mm pitch), (FPT-120P-M37) Plastic PFBGA 112-pin (0.8 mm pitch), (BGA-112P-M04) 111 D a t a S h e e t Package Dimensions 100-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 14.00 mm x 14.00 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold Mounting height 1.70 mm MAX Weight 0.65 g (FPT-100P-M23) 100-pin plastic LQFP (FPT-100P-M23) Note 1) * : These dimensions do not in
rk: 32 Kbyte 32 Kbyte MB9BF115RPMC-G-JNE2 Main: 384 Kbyte Work: 32 Kbyte 48 Kbyte MB9BF116RPMC-G-JNE2 Main: 512 Kbyte Work: 32 Kbyte 64 Kbyte MB9BF112NBGL-GE1 Main: 128 Kbyte Work: 32 Kbyte 16 Kbyte MB9BF114NBGL-GE1 Main: 256 Kbyte Work: 32 Kbyte 32 Kbyte MB9BF115NBGL-GE1 Main: 384 Kbyte Work: 32 Kbyte 48 Kbyte MB9BF116NBGL-GE1 Main: 512 Kbyte Work: 32 Kbyte 64 Kbyte Part number Document Number: 002-05622 Rev. *D Package Packing Plastic QFP 100-pin (0.65 mm pitch), (PQH100) Plastic LQFP 100-pin (0.5 mm pitch), (LQI100) Tray Plastic LQFP 120-pin (0.5 mm pitch), (LQM120) Plastic FBGA 112-pin (0.8 mm pitch), (LBC112) Page 109 of 117 MB9B110R Series 14. Package Dimensions Package Type Package Code LQFP 100 LQI100 D D1 75 4 D 5 7 51 D1 51 50 76 4 5 7 75 50 76 E1 E 5 4 7 E1 E 5 4 7 3 6 26 100 1 26 25 1 25 2 5 7 e 100 BOTTOM VIEW 0.1 0 C A-B D 3 0.2 0 C A-B D b TOP VIEW 8 0.0 8 C A-B D 2 A 9 A SEAT ING PLA NE A' 0.25 L1 0.0 8 C c A1 b 10 SECTION A-A' L SIDE VIEW SYMBOL DETAIL A DIMENSIONS MIN. NOM. MAX.
MB9BF116NPQC MB9BF112NPMC MB9BF114NPMC MB9BF115NPMC Plastic LQFP 100-pin (0.5mm pitch), (FPT-100P-M20*/M23) MB9BF116NPMC MB9BF112RPMC MB9BF114RPMC MB9BF115RPMC Plastic LQFP 120-pin (0.5mm pitch), (FPT-120P-M21*/M37) MB9BF116RPMC MB9BF112NBGL MB9BF114NBGL MB9BF115NBGL Plastic PFBGA 112-pin (0.8mm pitch), (BGA-112P-M04) MB9BF116NBGL * : ES product only 106 FUJITSU SEMICONDUCTOR CONFIDENTIAL DS706-00028-2v0-E r1.0 MB9B110R Series PACKAGE DIMENSIONS 100-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 14.0 mm x 14.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm Max Weight 0.65 g Code (Reference) P-LFQFP100-14x14-0.50 (FPT-100P-M20) 100-pin plastic LQFP (FPT-100P-M20) Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 16.000.20(.630.008)SQ *14.000.10(.551.004)SQ 75 51 76 50 0.08(.003) Details of "A" part +0.20 26 100 "A
MB9BF116NPQC MB9BF112NPMC MB9BF114NPMC MB9BF115NPMC Plastic LQFP 100-pin (0.5mm pitch), (FPT-100P-M20*/M23) MB9BF116NPMC MB9BF112RPMC MB9BF114RPMC MB9BF115RPMC Plastic LQFP 120-pin (0.5mm pitch), (FPT-120P-M21*/M37) MB9BF116RPMC MB9BF112NBGL MB9BF114NBGL MB9BF115NBGL Plastic PFBGA 112-pin (0.8mm pitch), (BGA-112P-M04) MB9BF116NBGL * : ES product only 106 FUJITSU SEMICONDUCTOR CONFIDENTIAL DS706-00028-2v0-E r1.0 MB9B110R Series PACKAGE DIMENSIONS 100-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 14.0 mm x 14.0 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.70 mm Max Weight 0.65 g Code (Reference) P-LFQFP100-14x14-0.50 (FPT-100P-M20) 100-pin plastic LQFP (FPT-100P-M20) Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 16.000.20(.630.008)SQ *14.000.10(.551.004)SQ 75 51 76 50 0.08(.003) Details of "A" part +0.20 26 100 "A